电子与封装
• 材料、器件与工艺 • 下一篇
姜万红，吴文单
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JIANG Wanhong, WU Wendan
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摘要： 阐述真空灌封工艺原理，灌封胶料选用和计量配胶系统的选择，形成一种可行的电子元器件真空灌封工艺流程。主要通过对真空灌封工艺技术的研究，以解决电子元器件在灌封过程中容易产生气泡或空洞等问题，实现电性能稳定性和可靠性提升。
关键词: 真空灌封, 电子元器件, 环氧胶, 工艺
Abstract: This article elaborates on the principles of vacuum potting processes, the selection of potting materials, and the design of metering and mixing systems to establish a feasible vacuum potting workflow for electronic components. Through research on vacuum potting technologies, this study aims to address issues such as bubble or void formation during potting, thereby enhancing electrical performance stability and reliability.
Key words: vacuum potting, electronic components, epoxy resin, process
姜万红, 吴文单. 电子元器件真空灌封工艺技术研究[J]. 电子与封装, doi: 10.16257/j.cnki.1681-1070.2025.0148.
JIANG Wanhong, WU Wendan. Research on the Vacuum Potting Technology for electronic Components[J]. Electronics & Packaging, doi: 10.16257/j.cnki.1681-1070.2025.0148.
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链接本文: https://ep.org.cn/CN/10.16257/j.cnki.1681-1070.2025.0148
