关键词: 系统级封装, 电源防反器, 铜夹互连, 小型化

Abstract: The cold-oring reverse polarity protector is a power device utilizing MOSFETs to prevent supply polarity reversal and current backflow. Characterized by low forward voltage drop, high current carrying capacity, and repaid response, it’s widely deployed in portable electronics, industrial equipment, and automotive system. Most existing MOSFET-based protectors employ board-level packaging, which suffers from high on-resistance, excessive thermal dissipation, and bulky dimensions. This paper presents a system-in-package encapsulation structure. By integrating power chips, control IC and passive components within a ceramic enclosure, the prototype achieves 32% reduction in thickness and 45% reduction in weight. Through interconnect optimization: cooper clip connection replacing traditional PCB leads connection, the on-resistance is significantly lowered. It get 43% decrease in forward voltage drop under high-temperature operation while demonstrating robust performance during full-loading conditions.

Key words: system in package, reverse polarity protector;, copper clip interconnect, miniaturization