电子与封装
• 封装、组装与测试 • 下一篇
祝军，王冰，余启迪，蒋乐
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ZHU Jun, Wang Bing, YU Qidi, Jiang Le
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摘要： 随着半导体技术日益高密度集成化发展，系统级封装（SiP）成为实现小型化微电子产品的重要技术路径。提出了基于晶圆级封装技术，通过重分布层（RDL）和环氧树脂成型的重组晶圆，实现小尺寸的微波变频SiP芯片。芯片内部主要集成混频器，低噪声放大器和滤波器等微波单片，实现将K、Ka波段的信号下变频到L波段，芯片尺寸仅为6.9 mm×5.2 mm×0.5 mm。相较于传统的微组装工艺，在多通道一致性，基于晶圆级封装工艺设计的微波变频SiP芯片都有着很大优势。
关键词: 晶圆级封装, 微波变频SiP, 小型化, 一致性
Abstract: With the increasingly high-density integration of semiconductor technology, system in package (SiP) has become an important technological path for achieving miniaturized microelectronic products. The article proposes a small-sized microwave SiP chip based on wafer level package technology, which uses redistribution layer (RDL) and epoxy resin to form a recombinant wafer. The chip mainly integrates microwave chips such as mixers, low-noise amplifiers, and filters, realizing the down conversion of K and Ka band signals to L band. The chip size is only 6.9mm × 5.2mm × 0.5mm. Compared with the traditional micro-assembly process, microwave frequency converter SiP chips designed based on wafer-level packaging process have great advantages in multi-channel consistency.
Key words: wafer level package, microwave SIP, miniaturization, consistency
祝军, 王冰, 余启迪, 蒋乐. 基于晶圆级封装的微波变频SiP设计[J]. 电子与封装, doi: 10.16257/j.cnki.1681-1070.2025.0092.
ZHU Jun, Wang Bing, YU Qidi, Jiang Le. Microwave Frequency Converter SiP Design Based on Wafer Level Packaging[J]. Electronics & Packaging, doi: 10.16257/j.cnki.1681-1070.2025.0092.
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链接本文: https://ep.org.cn/CN/10.16257/j.cnki.1681-1070.2025.0092
