关键词: 温度循环试验, 功率器件, 可靠性, 失效机理

Abstract: As the core components of power electronic systems, the reliability of power devices is very crucial. Current research on the failure mechanisms of power devices under temperature cycling (TC) loads is still insufficient. Therefore, this study adopts a method combining experimental characterization with failure mechanism analysis to investigate the failure modes and mechanisms of power devices under temperature cycling loads. This research aims to provide theoretical foundations and technical references for the reliability design and lifetime prediction of power devices in future applications. This paper first introduces the principles, objectives, and methods of the TC test. Then, the devices are subjected to TC testing, electrical parameter data are collected after the tests, Meanwhile, failure analysis on electrical failures revealed that cracks in the passivation layer allow moisture to penetrate the chip's interior, ultimately leading to thermal breakdown of the device. Finally, corresponding improvement strategies for the passivation layer are proposed from both material and process perspectives, providing technical guidance for product development.

Key words:

temperature cycling test, power devices, reliability, failure mechanisms