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中国电子学会电子制造与封装技术分会会刊

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• 材料、器件与工艺 •    下一篇

包含积累层沟道和4H-SiC/Si异质结集电区的SiC基RC-IGBT

叶枝展1,2,韦文生1,2   

  1. 1. 温州大学电气与电子工程学院,浙江 温州  325035;2. 温州大学浙江省智能低压电器和新能源应用重点实验室,浙江 温州  325035
  • 收稿日期:2025-10-14 修回日期:2025-12-26 出版日期:2026-01-05 发布日期:2026-01-05
  • 通讯作者: 韦文生
  • 基金资助:
    国家自然科学基金(62374116)

SiC Based RC-IGBT with 4H-SiC/Si Heterojunction Electrode and Accumulation Layer Channel

YE Zhizhan1,2, WEI Wensheng1,2   

  1. 1. College of Electrical and Electronic Engineering, Wenzhou University, Wenzhou 325035, China; 2. Zhejiang Key Laboratory of Smart Low-Voltage Apparatus and New Energy Application, Wenzhou University, Wenzhou 325035, China
  • Received:2025-10-14 Revised:2025-12-26 Online:2026-01-05 Published:2026-01-05

摘要: 构建了一种集成异质结集电区(HJC)和积累层沟道的碳化硅增强型逆导绝缘栅晶体管,简称HJC-RC-ACCUIGBT。使用积累层沟道而非反型层沟道,提高沟道的迁移率,降低器件的阈值电压Vth、比导通电阻Ron,sp和栅极氧化物/沟道界面态的不利影响。采用4H-SiC/Si/4H-SiC HJC代替n+型同质集电区来阻碍电子流通,增强电导调制,降低正向导通压降Von,消除电压折回现象但未弱化其他电学特性。利用TCAD软件仿真和优化了该器件的结构、静态和动态电学特性。结果表明,相对于采用反型层沟道的参照器件,此IGBT的Vth降低了15%,集电区饱和电流密度JCE提高了32%,栅氧化物/沟道界面态的影响减弱。对比没有HJC的参照器件,此IGBT完全消除了电压折回现象,Von和反向导通压降Vron分别降低了72%和12%,此HJC的界面态没有明显影响器件的电学特性。本文可为设计高性能RC-IGBT提供新的方案。

关键词: RC-IGBT, 积累层沟道, 4H-SiC/Si/4H-SiC异质结集电区, 电压折回现象

Abstract: A kind of silicon carbide based enhanced-mode reverse-conducting insulated gate transistor integrated with accumulation layer channel and 4H-SiC/Si/4H-SiC heterojunction collector (HJC) is devised, which is abbreviated as HJC-RC-ACCUIGBT. The accumulation-layer channel rather than inversion-layer one is adopted to raise the channel mobility, while reduce the threshold voltage Vth, specific on-resistance Ron,sp, adverse effect from interfacial states within the gate-oxide/semiconductor-channel. A 4H-SiC/Si/4H-SiC HJC instead of n+ 4H-SiC homogeneous one is employed to block the outflow of electrons under low-voltage condition, while enhance the conductance modulation and decrease the forward voltage-drop Von, and further eliminate the snapback phenomenon without weakening the other electrical performance. The structure, static and dynamic characteristics of the proposed IGBT are simulated and optimized by using the technology computer aided design‌ (TCAD) software. The results show that, compared to the counterpart with the inversion-layer channel, the Vth of the proposed IGBT is reduced by 15%, the saturation current density of the collector JCE is increased by 32%, the influence from the interfacial states is considered. The Snapback phenomenon in this IGBT is eliminated, and the Von and reverse conduction voltage-drop Vron are respectively reduced by 72% and 12% comparing to the counterpart with the HJC. There exists no significant influence from the interface states within the HJC on electrical properties of the device. This paper provides a new solution for devising the high-performance RC-IGBTs.

Key words: RC-IGBT, accumulation layer channel, 4H-SiC/Si/4H-SiC heterojunction collector, snapback phenomenon