关键词: 光电共封装CPO, 先进封装, 硅通孔TSV, 硅光模块

Abstract: Driven by the demands of artificial intelligence, high-performance computing, and hyper-scale data centers, the trend of "copper fading and fiber advancing" has become irreversible. Co-packaging of optoelectronics (CPO) technology, based on advanced packaging technology, co-encapsulates optical modules and electrical chips within the same package, shortening the interconnection length between them and reducing parasitic effects. It offers significant advantages such as wide bandwidth, electromagnetic interference resistance, low transmission loss, and low power consumption. CPO technology is a key path to break through the bottleneck of computing power and energy efficiency in the post-Moore era. This paper reviews the advantages and disadvantages of CPO packaging technology based on 2.5D and 3D advanced packaging technologies. It focuses on analyzing the process challenges faced by through-silicon via (TSV) in 3D CPO packaging technology, proposes corresponding process improvement methods, and provides references for the subsequent development of 3D CPO technology and optimization of TSV manufacturing processes.

Key words: co-packaged optics, advanced packaging, TSV, silicon photonic module