关键词: 玻璃芯基板, 热机械可靠性, 封装加固, 可靠性优化

Abstract: Focusing on the glass core substrate (GCS) in the large-scale heterogeneous integration of Chiplets, the reliabilities are reviewed, including interconnect reliability, board-level and system-level reliability, and structural reinforcement strategies. By summarizing the major reliability issues encountered by GCS and their key interconnect structures during fabrication and service, the research progress is analyzed across multiple scales, from interconnect structures to board-level and system level assemblies. The attention is given to stress concentration, crack initiation and propagation, interfacial delamination, warpage, and fatigue life prediction caused by the coefficient of thermal expansion (CTE) mismatch. Existing studies indicate that stress buffer layers, edge coating, pullback structural design, and coordinated CTE control at board-level and system-level can enhance the crack resistance, delamination resistance, and fatigue resistance of GCS and related glass-based packages by reducing local stress concentration, interfacial energy release rate and accumulation of inelastic strain. The reviewed studies provide useful guidance for reliability design, structural optimization and engineering applications of GCS.

Key words: glass core substrate, thermal mechanical reliability, packaging reinforcement, reliability optimization