关键词: 韬（τ）定律, 半导体, 芯片, EUV, 玻璃基板, 先进封装

Abstract: The human brain's thinking process follows a universal "priority selection" principle:  maximum efficiency and greatest value. However, different approaches yield different outcomes, and only wise thinking can lead to new horizons. Huawei has recently delivered a keynote speech on the τ (tau) Law, elucidating the innovative logical thinking transformation and Logic Folding technology. After six years of practice, without using expensive extreme ultraviolet (EUV) lithography machines or their associated supporting equipment and materials, Huawei has completed the tape-out of the Kirin chip-2026 and Kirin chip-2027. During the speech, Huawei disclosed that at a fixed process node, it has achieved a 55% increase in transistor density, a 41% improvement in energy efficiency ratio, and a 13% boost in clock frequency, while attaining a yield rate of nearly 100% through the adoption of intelligent redundancy technology. The transistor density is now approaching that of TSMC's 3nm process (N3),  and is expected to further reach the equivalent of a 1.4nm (N1.4) process node by 2031. This represents a novel innovation in the semiconductor field, which will profoundly reshape the entire electronic system ecosystem—from design software and manufacturing processes to equipment and subsequent advanced packaging. ASML's monopoly position on EUV lithography will also face significant challenges.

Key words: τ (tau)-law, semiconductor, chip, EUV, glass substrate, advanced packaging