关键词: MEMS真空封装, 晶圆级封装, 非蒸散型吸气剂膜, 封装材料, 封装工艺

Abstract: The main reasons for the decrease in vacuum degree in vacuum MEMS device cavities using non-evaporative getter (NEG) films are summarized, including material outgassing, small molecule penetration, micro leakage, and getter deactivation. The contributions of different getter types, packaging materials, and bonding processes to high vacuum maintenance of MEMS devices are compared in terms of adsorption principle, material properties, and process compatibility. The vacuum packaging performance testing technology of MEMS devices is elaborated from the aspects of tightness testing, direct vacuum testing, stability and life evaluation. Finally, the key issues faced by current vacuum packaging of MEMS devices are pointed out, and the development trend of its high vacuum maintenance is projected, indicating the urgent need for miniaturization and low-temperature activatable getters with excellent performance.

Key words: MEMS vacuum packaging,  wafer level packaging, non-evaporable getter films, packaging material, packaging process