关键词: PCIe, 温度, SYSMON, 链路建链, 稳定性

Abstract:

Peripheral Component Interconnect Express (PCIe) serves as the core interconnection bus between servers and peripheral devices, and its link stability directly determines the overall reliability of the system. Aiming at the problem that signal attenuation, interference and other factors in complex temperature environments are prone to cause PCIe link bit errors and even interruptions, this paper proposes an optimized design scheme for PCIe link stability based on the System Monitor (SYSMON) inside the Field-Programmable Gate Array (FPGA). First, the scheme conducts a full temperature point traversal test within a wide temperature range (-55-125 ℃) to accurately calibrate the temperature thresholds and optimal link parameter combinations. In the system architecture, the SYSMON module is introduced to realize real-time acquisition of temperature data; the PCIe link dynamically switches parameter configurations by comparing the measured temperature with the preset thresholds, and the upper computer visualizes the link status in real time and feeds back abnormal information. A data loopback test platform was constructed to conduct repeated tests on the links of ten target chips under extreme ambient temperatures. The results show that the link establishment success rate of the optimized scheme reaches 100% under extreme high-temperature environments, which is significantly superior to the traditional scheme, fully verifying the high reliability and engineering practical value of the optimized scheme.

Key words: PCIe, temperature, SYSMON, link establishment, stability