关键词: 金硅焊接, 芯片背金, 阻挡层, 原子扩散, 可靠性

Abstract: The demand for automated silicon-chip soldering is increasingly growing in the production of high-power and high-reliability integrated circuits. Based on the industry-standard gold-silicon soldering process, the Au-Si bonding processes for chips with different gold-backing structures and different plated tube shells is analyzed. The impact of silicon atom diffusion across interfaces on product reliability is systematically discussed. The study demonstrates that adding cobalt as a barrier layer to the package plating effectively inhibits the reaction between silicon from the chip and nickel preventing the formation of brittle intermetallic compound layers that are detrimental to bonding. This approach ensures excellent post-soldering interfacial integrity and broadens the process window. Furthermore, the high reliability of the gold-silicon soldering for silicon chips was validated through rigorous extreme testing.

Key words: Au-Si eutectic bonding, gold-plated chip, barrier layer, atomic diffusion, reliability