关键词: 覆铜陶瓷载板, 局部放电, 蚀刻, 界面缺陷, 绝缘老化

Abstract: With the widespread adoption of insulated-gate bipolar transistors (IGBT) and inverters in the new energy sector, and with the continuous increase in the power density of control systems, the thermal management advantages of copper-clad ceramic substrates have become increasingly prominent. However, the mismatch in thermal expansion coefficients between ceramics and metals, as well as defects at the interface, have emerged as key bottlenecks that limit their long-term reliability. Against this backdrop, the analysis of failure mechanisms in copper-clad ceramic substrates has become a critical research focus. This paper presents a systematic review of failures induced by partial discharge, focusing on ceramic porosity, voids at the ceramic-metal interface, etching residues, sharp protrusions at metal edges, and the "three-phase point" in packaging. By analyzing the mechanisms through which partial discharge behavior accelerates insulation aging, the paper proposes process improvement measures and control strategies to optimize the design and manufacturing of high-reliability copper-clad ceramic substrates, thereby enhancing their overall service reliability.

Key words: copper-clad ceramic substrates, partial discharge, etching, interface defects, insulation aging