关键词: 自适应封装, 高密度叠层, 垂直互联

Abstract: In order to effectively solve the problem of electrical interconnection bottleneck in the transmission process of Ka band signals between multilayer high-density stacked substrates,we use the micro solder sphere to achieve vertical interconnection and support connection between layers,while achieving high density stacked adaptive package,which made a high density integrated miniaturized millimeter wave SIP low transmission loss module.We studied he design and fabrication process of high density stacked adaptive packaging based on micro solder sphere in Ka band，and we have broken through the high density stacked adaptive packaging micro solder ball collapse rate accurate control process,vertical interconnection and electromagnetic isolation design based on the micro solder ball,SIW filter embedded,welding technology of high density multilayer substrate.

Key words: adaptive packaging, high density stack, vertical interconnection