关键词: 倒装焊, 声表面波器件, 失效分析

Abstract: The paper briefly introduces the encapsulation form of integrated circuit,and briefly analyzes the application and development trend of flip chip welding technology in surface acoustic wave device.The application of flip chip technology in surface acoustic wave device is introduced in detail.The difference between wire bonding technology and flip chip welding technology is compared,and the advantages of flip chip welding technology are introduced.The whole process of flip chip technology is briefly introduced.Each key process in the process of production is described in detail,and the failure forms in the later stage of the product are analyzed briefly.

Key words: flip chip bonding, acoustic surface waves, invalidation analysis