关键词: 第三代半导体器件, 环氧塑封料, 高可靠性

Abstract: The third generation semiconductor devices are favored by the market for their stable operation under high temperature, high voltage, and high frequency conditions. Epoxy molding compound (EMC) plays an important role in the reliability of devices. Through the preparation of various types of resin and the addition of various ion scavengers, a high performance EMC is optimized. The glass transition temperature (T_g) of the EMC is up to 190 ℃, the adhesion to metal silver is up to 73.5 N/cm², and its flame retardant grade reaches UL94 V-0. The reliability of the EMC is verified by simulation packaging, and the results show that the simulated packaging samples in laboratory can reach the first level of moisture absorption sensitivity (MSL1). The sample has been verified in many aspects by packaging factory and has shown good reliability on the SiC semiconductor field effect transistor (MOSFET) with a voltage up to 1700 V, passing a series of reliability tests such as electrical performance reliability, environmental reliability, and use reliability. This high reliability epoxy molding compound is expected to be used in third generation semiconductor devices with the high temperature and high voltage resistance.

Key words: third generation semiconductor devices, epoxy molding compound, high reliability