基于晶圆键合的MEMS圆片级封装研究综述*

doi:10.16257/j.cnki.1681-1070.2022.1201

摘要/Abstract

摘要： 为提升微机电系统（MEMS）器件的性能及可靠性，MEMS圆片级封装技术已成为突破MEMS器件实用化瓶颈的关键，其中基于晶圆键合的MEMS圆片级封装由于封装温度低、封装结构及工艺自由度高、封装可靠性强而备受产学界关注。总结了MEMS圆片级封装的主要功能及分类，阐明基于晶圆键合的MEMS圆片级封装技术的优势。依次对平面互连型和垂直互连型2类基于晶圆键合的MEMS圆片级封装的技术背景、封装策略、技术利弊、特点及局限性展开了综述。通过总结MEMS圆片级封装的现状，展望了未来的发展趋势。

关键词: 晶圆键合, 微机电系统, 圆片级封装, 平面互连, 垂直互连

Abstract: To improve the performance and reliability of micro-electro-mechanical system (MEMS) devices, MEMS wafer-level packaging technology has become the shortcut to break through the bottleneck of MEMS device practicality. Wherein, MEMS wafer-level packaging based on wafer bonding has attracted much attention in the industry and academia owing to its low packaging temperature, high freedom in packaging structures and processes, and high structural reliability. The main functions and classifications of MEMS wafer-level packaging are summarized, and the advantages of MEMS wafer-level packaging technology based on wafer bonding are clarified. MEMS wafer-level packaging approaches based on wafer bonding, which can be divided into two types of the planar interconnection and the vertical interconnection, are reviewed with illustrations of technical backgrounds, packaging strategies, advantages/disadvantages, and limitations. The current situation of MEMS wafer-level packaging is summarized, and the future development trend is prospected.

Key words: wafer bonding, micro-electro-mechanical system, wafer-level packaging, planar interconnection, vertical interconnection

中图分类号:

TN305.94

梁亨茂. 基于晶圆键合的MEMS圆片级封装研究综述^*[J]. 电子与封装, 2022, 22(12): 120201 .

LIANG Hengmao. Review of MEMS Wafer-Level Packaging Based on Wafer Bonding Techniques[J]. Electronics & Packaging, 2022, 22(12): 120201 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

基于晶圆键合的MEMS圆片级封装研究综述^*

Review of MEMS Wafer-Level Packaging Based on Wafer Bonding Techniques

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