中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2022, Vol. 22 ›› Issue (12): 120402 . doi: 10.16257/j.cnki.1681-1070.2022.1208

• 材料、器件与工艺 • 上一篇    下一篇

高温SOI技术的发展现状和前景

罗宁胜;曹建武   

  1. CISSOID中国代表处,广东 深圳 518118
  • 收稿日期:2022-05-26 发布日期:2022-10-26
  • 作者简介:罗宁胜(1965—),男,湖南长沙人,博士,CISSOID中国总经理,主要负责目标应用领域的技术发展趋势分析、高温半导体产品开发的需求分析,及高温SiC智能功率模块的规格定义、研发管理等工作。

Development Status and Prospects of High-Temperature SOI Technology

LUO Ningsheng, CAO Jianwu   

  1. CISSOID China Office,Shenzhen 518118, China
  • Received:2022-05-26 Published:2022-10-26

摘要: 高温绝缘层上硅(SOI)技术突破了体硅半导体器件的高温困境,已被广泛应用于石油天然气钻探、航空航天和国防装备等尖端领域。近年来,第三代宽禁带半导体功率器件已日趋成熟和普及,其中SiC器件以其先天的耐高压、耐高温等特性,与高温SOI器件是非常理想的搭配,适用于原本体硅半导体功率器件难以实现或根本不能想象的应用场景,为系统应用设计者提供了全新的拓展空间。在简述体硅半导体器件高温困境的基础上,综述了高温SOI技术的发展现况,并探讨了其未来的发展方向和应用前景。

关键词: 体硅, 绝缘层上硅, SiC, 高温SOI技术

Abstract: The high-temperature silicon-on-insulator (SOI) technology breaks through the high-temperature dilemma of bulk silicon semiconductor devices, and has been widely applied in cutting-edge fields such as oil and gas drilling, aerospace and defense equipment. In recent years, the third-generation wide-bandgap semiconductor power devices have become more and more mature and popular. Among them, SiC devices, due to their inherent high voltage resistance and high-temperature resistance, being very ideal for matching with SOI devices, can handle application scenarios that are difficult to achieve or simply unimaginable for bulk silicon based power devices, and provide system application designers with a new room for expansion. Based on the brief description of the high-temperature dilemma of bulk silicon semiconductor devices, the development status of high-temperature SOI technology are reviewed, and its future development directions and application prospects are discussed.

Key words: bulk silicon, silicon on insulator, SiC, high temperature SOI technology

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