关键词: PIN二极管, 钝化技术, 电学特性, 可靠性, 复合介质膜

Abstract: Surface passivation is one of the important processes in the fabrication of semiconductor devices and has significant impact on the electrical characteristics and reliability of devices. The reliability and passivation technology of microwave PIN diode chip are inseparable. The composite dielectric film of microwave PIN diode is prepared by the high temperature dry oxygen and plasma enhanced chemical vapor deposition (PECVD) process. Through the measurement and analysis of the parameters, such as film thickness, refractive index, surface square resistance, forward resistance and diode junction capacitor, surface passivation film with good density and high insulation strength is obtained by the optimization of the process conditions. The reliability and environmental adaptability of the microwave PIN diode chip are improved.

Key words: PIN diode, passivation technology, electrical characteristics, reliability, composite dielectric film