环氧塑封料用热潜伏型固化促进剂的研究与应用进展*

doi:10.16257/j.cnki.1681-1070.2022.0901

摘要/Abstract

摘要： 环氧塑封料（EMC）是集成电路芯片（IC）先进封装的关键材料之一，而固化促进剂又是影响EMC在IC先进封装应用中的可靠性的重要成分之一。综述了近年来国内外EMC用热潜伏型固化促进剂（TLC）在基础与应用领域中的研究进展。从IC先进封装用EMC的发展趋势、EMC的发展对TLC的性能需求以及当前IC封装应用中的主流EMC相关TLC材料的研究现状等几个方面进行了阐述。重点阐述了有机磷系络合型本征型TLC的研究与发展状况，以及对先进EMC用TLC组分的未来发展趋势进行了展望。

关键词: 集成电路封装, 环氧塑封料, 固化促进剂, 热潜伏性

Abstract: Epoxy molding compounds (EMC) represent a class of key materials for integrated (IC) chip packaging, while curing accelerator is one of the most important components affecting the reliability of EMC in IC packaging. The latest progress on the research and applications of thermally latent curing accelerators (TLC) for EMCs has been reviewed. The developing trends of EMC for IC packaging application, the property requirements of TLC for EMC, and the main types of TLC for the current EMC products are mainly introduced. Emphatically, the developing status of phosphorus complexes types of intrinsic TLC compounds was presented. At last, the future developing trends of TLCs in advanced EMCs were prospected.

Key words: integrated circuit packaging, epoxy molding compound, curing accelerators, thermal latency

中图分类号:

王璐;常白雪;岳艺宇;吴宇林;吴昊;陈淑静;刘金刚. 环氧塑封料用热潜伏型固化促进剂的研究与应用进展^*[J]. 电子与封装, 2022, 22(9): 090201 .

WANG Lu, CHANG Baixue, YUE Yiyu, WU Yulin, WU Hao, CHEN Shujing, LIU Jingang. Progress on the Research and Application of Thermally Latent Curing Acceleratorsin Epoxy Molding Compounds[J]. Electronics & Packaging, 2022, 22(9): 090201 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

环氧塑封料用热潜伏型固化促进剂的研究与应用进展^*

Progress on the Research and Application of Thermally Latent Curing Acceleratorsin Epoxy Molding Compounds

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