关键词: 分形结构, 天线封装一体化, 有机基板, 再布线, 晶圆级封装

Abstract: An antenna-chip integratedRF module based on fractal structure is designed and fabricated. A fractal inductance based on the 4-order Hilbert curve and an antenna based on the 2-order Sierpinski triangle are designed. The space utilization rate of integrated module is improved effectively, and the miniaturization of electronic devices is realized. The radiation frequency points in antenna structure are adjustable by changing feed positions. At most, three radiation frequency points of 36 GHz, 50 GHz, 70.6 GHz can be realized, which makes the application scenarios flexible.The return loss at each radiation frequency point is higher than 25dB, and the maximum radiation direction gain is 11.93dB. In order to integrate fractal antenna and RF chip, an antenna-chip integrated RF module architecture with 12-inch wafer-level embedded substrate technology is designed and implemented.Compared with the existing RF device integration technology, photolithography is used to realize vertical high-density interconnection between antenna and chip, and improved the RF performance of the system.

Key words: fractal structure, antenna package integration, organic substrate, re-distribution layer, waferlevel package