关键词: 智能卡, 机械强度, 三轮测试, 失效现象

Abstract: Mechanical strength is an important indicator for evaluating the reliability of contact and dual-interface smart cards. Product failures occur from time to time during mechanical strength testing. Therefore, it is very important to conduct an in-depth study of failure phenomena those occur during mechanical strength testing of contact and dual-interface smart cards. Starting from the structure and materials of smart cards and the whole manufacturing process, including chip manufacturing, module packaging and smart card assembly, the factors affecting the mechanical strength of smart cards are studied. By analyzing and summarizing the physical characteristics of bare chips, carrier types, surface roughness of bare chips, sealing process of the modules and the milling groove parameters, measures and optimization directions for improving the mechanical strength of smart cards are proposed.

Key words: smart cards, mechanical strength, three-wheel testing, failure phenomenon