人工智能芯片先进封装技术

doi:10.16257/j.cnki.1681-1070.2024.0011

摘要/Abstract

摘要： 随着人工智能（AI）和集成电路的飞速发展，人工智能芯片逐渐成为全球科技竞争的焦点。在后摩尔时代，AI芯片的算力提升和功耗降低越来越依靠具有硅通孔、微凸点、异构集成、Chiplet等技术特点的先进封装技术。从AI芯片的分类与特点出发，对国内外典型先进封装技术进行分类与总结，在此基础上，对先进封装结构可靠性以及封装散热等方面面临的挑战进行总结并提出相应解决措施。面向AI应用，对先进封装技术的未来发展进行展望。

关键词: 人工智能芯片, 先进封装, 可靠性, 封装散热

Abstract: With the rapid development of artificial intelligence (AI) and integrated circuits, artificial intelligence chips have become the focus of global science and technology competition. In the post-Moore era, the computing power enhancement and power dissipation reduction of AI chips increasingly rely on advanced packaging technologies with characteristics such as TSV, micro-bump, heterogeneous integration and Chiplet. Starting from the classification and characteristics of AI chips, the typical advanced packaging technologies at home and abroad are classified and summarized. On this basis, the challenges faced by advanced packaging structure reliability and packaging heat dissipation are summarized and corresponding solutions are proposed. The future development of advanced packaging technology is prospected for AI applications.

Key words: artificial intelligence chips, advanced packaging, reliability, packaging heat dissipation

中图分类号:

TN305.94

田文超;谢昊伦;陈源明;赵静榕;张国光. 人工智能芯片先进封装技术[J]. 电子与封装, 2024, 24(1): 010204 .

TIAN Wenchao, XIE Haolun, CHEN Yuanming, ZHAO Jingrong, ZHANG Guoguang. Advanced Packaging Technology for Artificial Intelligence Chips[J]. Electronics & Packaging, 2024, 24(1): 010204 .

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