三维集成电路先进封装中聚合物基材料的研究进展*

doi:10.16257/j.cnki.1681-1070.2024.0149

摘要/Abstract

摘要： 人工智能、大数据、物联网和可穿戴设备的迅猛发展，极大地催生了对高端芯片的需求。随着摩尔定律发展趋缓，尺寸微缩技术使芯片遭遇了物理节点失效、经济学定律失效，以及性能、功耗、面积指标不足等诸多问题。作为延续和拓展摩尔定律的重要赛道，三维先进封装技术已成为推动高端芯片向多功能化以及产品多元化集聚发展的重要动力。先进封装技术的迅猛发展对聚合物基关键封装材料的耐腐蚀性、电气、化学和机械性能都提出了更高的要求。针对三维集成电路的先进封装工艺需求，论述了不同聚合物基关键材料的研究进展及应用现状，明晰了不同聚合物基材料所面临的挑战和机遇，提出了相应的解决方案，并展望了未来的研究方向。

关键词: 先进封装, 三维封装, 聚合物, 临时键合

Abstract: The rapid development of artificial intelligence, big data, the Internet of Things, and wearable devices has greatly spurred the demand for high-end chips. With the development of Moore's Law slowing down, dimensional miniaturization technology has caused chips to encounter many problems such as failure of physical nodes, failure of the law of economics, and insufficient performance, power consumption and area indicators. As an important track for extending and expanding Moore's Law, three-dimensional advanced packaging technology has become a significant driving force for the convergence of high-end chips towards multi-functionalization and product diversification. Alongside the rapid development of advanced packaging technology, higher requirements are placed on the corrosion resistance, electrical, chemical, and mechanical properties of polymer-based key packaging materials. Addressing the advanced packaging process requirements for 3D integrated circuits, the research progress and application status of different polymer-based key materials are discussed, the challenges and opportunities faced by different polymer-based materials are clarified, corresponding solutions are proposed, and future research directions are envisioned.

Key words: advanced packaging, 3D packaging, polymer, temporary bonding

中图分类号:

范泽域, 王方成, 刘强, 黄明起, 叶振文, 张国平, 孙蓉. 三维集成电路先进封装中聚合物基材料的研究进展^*[J]. 电子与封装, 2024, 24(6): 060107 .

FAN Zeyu, WANG Fangcheng, LIU Qiang, HUANG Mingqi, YE Zhenwen, ZHANG Guoping, SUN Rong. Research Progress of Polymer-Based Materials for Advanced Packaging of 3D Integrated Circuits[J]. Electronics & Packaging, 2024, 24(6): 060107 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

三维集成电路先进封装中聚合物基材料的研究进展^*

Research Progress of Polymer-Based Materials for Advanced Packaging of 3D Integrated Circuits

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