PBGA焊点形态对疲劳寿命的影响*

doi:10.16257/j.cnki.1681-1070.2024.0095

电子与封装 ›› 2024, Vol. 24 ›› Issue (8): 080206 . doi: 10.16257/j.cnki.1681-1070.2024.0095

PBGA焊点形态对疲劳寿命的影响^*

张威;刘坤鹏;张沄渲;于沐瀛;王尚;田艳红

哈尔滨工业大学材料结构精密焊接与连接全国重点实验室，哈尔滨?150001

收稿日期:2024-01-30 出版日期:2024-09-11 发布日期:2024-09-11
作者简介:张威（1977—），男，吉林长春人，博士，主要研究方向为电子封装可靠性、微电子器件与封装的建模与仿真。

Effect of PBGA Solder Joint Morphology on Fatigue Life

ZHANG Wei, LIU Kunpeng, ZHANG Yunxuan, YU Muying, WANG Shang, TIAN Yanhong

State Key Laboratoryof Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China

Received:2024-01-30 Online:2024-09-11 Published:2024-09-11

摘要/Abstract

摘要： 通过Surface Evolver软件预测了塑料球栅阵列（PBGA）焊点形态，将焊点形态结果导入Ansys软件中进行-55~125 ℃热循环仿真实验，通过Coffin-Masson模型预测焊点寿命。选取焊点钎料量、焊点高度、下焊盘直径作为影响焊点寿命的主要因素进行了3因素3水平正交实验，通过均值响应分析得到了影响凸点寿命的最敏感因素及最优形态尺寸组合。结果表明对焊点寿命影响最大的因素为下焊盘半径，其次是钎料量，最后是焊点高度，且上下等大的焊盘具有较好的可靠性。

关键词: Surface Evolver, 塑料球栅阵列, 焊点形态预测, 热循环, 疲劳寿命, 封装技术

Abstract: The solder joint morphology of plastic ball grid array (PBGA) is predicted by Surface Evolver software, the results of the solder joint morphology are imported into Ansys software to conduct thermal cycling simulation experiments from -55 ℃ to 125 ℃, and the solder joint life is predicted by Coffin-Masson model. The three factors and three levels of orthogonal experiments are carried out by selecting the amount of brazing material in the solder joint, the height of the solder joint, and the diameter of the lower pad as the main factors affecting the life of the solder joint, and the most sensitive factor affecting the life of the bump and the optimal combination of morphology and size are obtained through the mean-response analysis. The results show that the most influential factor on the life of the solder joint is the lower pad radius, followed by the amount of solder, and finally the height of the solder joint. Additionally, the upper and lower pads of equal size have better reliability.

Key words: Surface Evolver, plastic ball grid array, solder joint morphology prediction, thermal cycling, fatigue life, packaging technology

中图分类号:

TG425⁺.1

张威;刘坤鹏;张沄渲;于沐瀛;王尚;田艳红. PBGA焊点形态对疲劳寿命的影响^*[J]. 电子与封装, 2024, 24(8): 080206 .

ZHANG Wei, LIU Kunpeng, ZHANG Yunxuan, YU Muying, WANG Shang, TIAN Yanhong. Effect of PBGA Solder Joint Morphology on Fatigue Life[J]. Electronics & Packaging, 2024, 24(8): 080206 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

PBGA焊点形态对疲劳寿命的影响^*

Effect of PBGA Solder Joint Morphology on Fatigue Life

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