关键词: 热界面材料, 热导率, 可靠性, 加速寿命实验

Abstract: With the development of convenient electronic devices toward multifunctionality and miniaturization, there is an urgent need to reduce the chip temperature and improve packaging heat dissipation performance. Thermal interface materials (TIMs) are key materials that fill interfacial gaps and ensure heat dissipation channels at the interfaces between different materials. The performance of TIMs has a vital impact on the stable operation and lifetime of packaged devices. Through the investigation of TIM research progress, the strengths and weaknesses of existing TIMs are summarized and primary methodologies for enhancing their thermal conductivity are explored, including matrix thermal optimization, filler design, and interfacial modification techniques. The common thermal performance characterization methods, failure modes, accelerated life testing, and life prediction models for TIMs are reviewed, and the key factors affecting the reliability of TIMs are classified and explained. In addition, in-situ testing and machine learning-assisted degradation prediction are emerging as new directions for improving the efficiency and accuracy of TIM reliability assessment. The summary of the implementation and reliability research methods for TIMs with high thermal conductivity can provide a reference for research on the development, testing, and application evaluation of TIMs with high thermal conductivity and high reliability.

Key words: thermal interface material, thermal conductivity, reliability, accelerated life test