玻璃通孔技术的力学可靠性问题及研究进展*

doi:10.16257/j.cnki.1681-1070.2025.0160

摘要/Abstract

摘要： 随着集成电路持续朝高密度、高性能方向发展，玻璃通孔（TGV）互连技术由于具有优异的电学、光学特性，良好的力学稳定性和低成本等优势，在三维电子封装、集成无源器件和光电器件集成方面具有广泛应用前景。系统综述TGV在芯片封装中的应用背景、制造工艺、材料选择及其所面临的主要力学挑战。对比玻璃中介层技术与硅通孔互连，总结TGV在成本、电学性能及机械稳定性方面的优势。阐述TGV与玻璃面板的制造流程，并强调常用玻璃材料（硅酸盐玻璃、石英玻璃和硼硅酸盐玻璃）的力学性能差异。重点分析TGV技术所面临的力学挑战，并给出潜在的解决方案。研究结果可为后续TGV结构优化与高可靠性封装设计提供一定的理论依据与工程指导。

关键词: 玻璃通孔, 先进封装, 力学性能, 可靠性

Abstract: With the continuous development of integrated circuits towards high density and performance, through glass via (TGV) interconnection technology has shown broad prospects for applications in three-dimensional electronic packaging, integrated passive devices, and optoelectronic device integration due to its advantages of excellent electrical and optical properties, excellent mechanical reliability, and low cost. A comprehensive review of the application background, manufacturing process, material selection, and key mechanical challenges of TGV in chip packaging is provided. The advantages of TGV over through silicon via technology are summarized in terms of cost, electrical performance, and mechanical stability. The manufacturing process of TGV and glass panel is elaborated in detail, and the differences of mechanical properties among commonly adopted glass materials (silicate glass, quartz glass, and borosilicate glass) are highlighted. A detailed discussion of the mechanical challenges faced by TGV technology is presented, along with potential solutions. The research results can provide a theoretical and engineering reference for optimizing TGV structures and designing high-reliability packaging in future applications.

Key words: through glass via, advanced packaging, mechanical property, reliability

中图分类号:

马小菡，董瑞鹏，万欣，贾冯睿，龙旭. 玻璃通孔技术的力学可靠性问题及研究进展^*[J]. 电子与封装, 2025, 25(7): 070109 .

MA Xiaohan, DONG Ruipeng, WAN Xin, JIA Fengrui, LONG Xu. Mechanical Reliability Issues and Research Progress of Through Glass Via Technology[J]. Electronics & Packaging, 2025, 25(7): 070109 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

玻璃通孔技术的力学可靠性问题及研究进展^*

Mechanical Reliability Issues and Research Progress of Through Glass Via Technology

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