IPM封装模块焊接与金线键合工艺研究

doi:10.16257/j.cnki.1681-1070.2025.0079

电子与封装 ›› 2025, Vol. 25 ›› Issue (8): 080201 . doi: 10.16257/j.cnki.1681-1070.2025.0079

IPM封装模块焊接与金线键合工艺研究

王仙翅^1,2，刘洪伟^1,2，刘晓鹏^1,2，蔡钊^1,2，朱亮亮^1,2，杜隆纯^1,2

1. 湖南国芯半导体科技有限公司，湖南株洲 412001；2. 湖南省功率半导体创新中心，湖南株洲 412001

收稿日期:2024-11-20 出版日期:2025-09-02 发布日期:2025-02-13
作者简介:王仙翅（1994—），男，湖南娄底人，硕士，主要研究方向为功率半导体封装、GaN器件与封装。

Research on Welding and Gold Wire Bonding Process of IPM Packaging Modules

WANG Xianchi^1,2, LIU Hongwei^1,2, LIU Xiaopeng^1,2, CAI Zhao^1,2, ZHU Liangliang^1,2, DU Longchun^1,2

1. CoresingSemiconductor Technology Co., Ltd., Zhuzhou 412001, China;2. Hunan Power Semiconductor Innovation Center, Zhuzhou 412001, China

Received:2024-11-20 Online:2025-09-02 Published:2025-02-13

摘要/Abstract

摘要： 在智能功率模块（IPM）制备过程中，焊接质量和金线键合质量直接影响IPM性能。研究了焊接工艺参数对Pb_92.5Sn₅Ag_2.5真空回流焊接质量的影响，以及键合工艺参数对金线键合性能的影响，并对焊接和金线键合工艺进行优化，制备了一款IPM，对其进行双脉冲测试。研究结果表明，活化温度和时间、回流区升温时间、回流温度和时间、降温速率等焊接参数都对焊接质量有规律性影响。优化焊接工艺后焊层空洞率均值约为3.8%，剪切强度均值为32.15 MPa，表现出良好的焊接质量。优化金线键合工艺后，键合金线的键合压球尺寸和厚度均值分别为85.4 µm和19.3 µm，剪切强度均值为42.4 gf，金线的拉力均值为21.4 gf，键合质量良好。双脉冲测试结果表明，基于优化工艺制备的IPM性能良好。

关键词: 智能功率模块, 焊接, 金线键合

Abstract: The welding quality and gold wire bonding quality have a direct impact on the performance of intelligent power modules (IPMs) during the preparation process. The influence of welding process parameters on the quality of vacuum reflow soldering of Pb_92.5Sn₅Ag_2.5 and the effect of bonding process parameters on the bonding performance of gold wires are studied. After optimizing the welding and gold wire bonding processes, an IPM module is fabricated and subjected to dual-pulse testing. The research results show that the welding parameters such as activation temperature and time, reflow zone heating time, reflow temperature and time, and cooling rate have a regular impact on welding quality. The average porosity of the weld layer is about 3.8% and the average shear strength is 32.15 MPa under the optimized welding process, demonstrating good welding quality. Under the optimized gold wire bonding process, the average size and thickness of the bonding balls are 85.24 µm and 19.3 µm, respectively, the average shear strength is 42.54 gf and the average tensile strength of the gold wires is 21.4 gf, indicating good bonding quality. Furthermore, it is proven that the IPM prepared based on the optimized process described above has good performance after double pulse testing.

Key words: intelligent power module, welding, gold wire bonding

中图分类号:

TN305.94

王仙翅，刘洪伟，刘晓鹏，蔡钊，朱亮亮，杜隆纯. IPM封装模块焊接与金线键合工艺研究[J]. 电子与封装, 2025, 25(8): 080201 .

WANG Xianchi, LIU Hongwei, LIU Xiaopeng, CAI Zhao, ZHU Liangliang, DU Longchun. Research on Welding and Gold Wire Bonding Process of IPM Packaging Modules[J]. Electronics & Packaging, 2025, 25(8): 080201 .

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中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

IPM封装模块焊接与金线键合工艺研究

Research on Welding and Gold Wire Bonding Process of IPM Packaging Modules

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