关键词: 板间连接器, 焊接工艺, 真空汽相焊, 预成型焊锡环

Abstract: The pin-through-hole soldering consistency and reliability of the electrical connectors on mixed printed circuit board (PCB) have attracted much attention. Actually, there are endless designs to pursue a defect-free soldering process. However, few schemes can adjust the amount of solder, improve the porosity, enhance the effect of through-hole penetration rate, and put them into application in actual production. Based on PCB electrical connectors, the orthogonal test is utilized to systematically analyze the influence of soldering approaches, PCB thickness, the amount of solder preform rings, and other process parameters on the quality of through-hole solder joints. By means of modeling and simulation, theoretical calculation, and metallographic analysis of through-hole solder joints, proposing a feasibility process of combining vacuum vapor soldering technology and solder preform ring to solder the connectors has been researched in detail. The results reveal that such an approach achieves a superior soldering quality, low porosity, and a through-hole solder joint penetration rate of 100%.

Key words: PCBelectricalconnectors, solderingtechnology, vacuumvaporsoldering, solderpreformring