关键词: CBGA器件, 焊接工艺, 热失配, 可靠性

Abstract: Ceramic ball grid array package (CBGA) is widely used in military, aerospace and aerospace electronics manufacturing fields due to its excellent electrical properties and air tightness. The thermal mismatch between the CBGA ceramic substrate and the printed circuit board (PCB) has always been the main concern of CBGA package reliability research. This paper studied the assembly process of CBGA devices and analyzed the failure mechanism of solder joints under temperature cycling (-55~+ 100 ℃) and random vibration. The results showed that the solder joint cracked under the combined stress of temperature cycling and random vibration. The solder joints at the four corners of the device were the first to crack. After After the temperature cycle test, the IMC layer formed by the solder joint of the CBGA device increased slightly.

Key words: CBGApackages, solderingtechnology, thermalmismatch, reliability