关键词: 硅微粉, 球形度, 环氧模塑料, 流动性

Abstract: Silicon powder is an important component of epoxy molding compound used in electronic packaging, and its content accounts for more than 70% of the epoxy molding compound. The dimensions and gradation of silicon powder can seriously affect the processing and physical properties of epoxy molding compound, especially the melt flow of epoxy molding compound. At present, there is no unified standard for the sphericity of silicon powder at home and abroad, and there is no report on the influence of the sphericity of silicon powder on the melt flow of epoxy molding compound. The sphericity of silicon powder is characterized by adding angular silicon powder to spherical silicon powder, so as to study and analyze the effect of silicon powder with different sphericity on the flow of epoxy molding compound.

Key words: silicon powder, sphericity, epoxy molding compound, meltflow