关键词: 金锡熔封, 粒子碰撞噪声检测, 焊料内溢, 预熔焊料盖板, 局部镀金

Abstract: Gold-tin solder sealing is one of the main lid-sealing technologies for hermetic packaging. Solder inner overflowing is a common phenomenon in gold-tin solder sealing process. Solder inner overflowing will reduce the space between bonding wires and the cover lid, and even cause short circuit in serious cases. It can also cause particle impact noise detection (PIND) tests to fail occasionally.The causes of solder inner overflow are discussed, and the control measures for inner overflow are put forward from the aspects of packaging design, cap clamp, cover lid plating and so on.

Key words: gold-tin solder sealing, particle impact noise detection, solder inner overflowing, prefusion solder cover lid, localized gold plating