中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2024, Vol. 24 ›› Issue (1): 010201 . doi: 10.16257/j.cnki.1681-1070.2024.0001

• 封装、组装与测试 •    下一篇

封装用玻璃基板的热应力翘曲研究

闫伟伟;朱泽力;李景明   

  1. 深圳莱宝高科技股份有限公司,广东 深圳? 518000
  • 收稿日期:2023-07-28 出版日期:2024-01-15 发布日期:2024-01-15
  • 作者简介:闫伟伟(1987—),女,河南平顶山人,硕士,工程师,主要从事电子显示产品热性能、热致变形仿真技术的研究。

Research on Thermal Stress Warping of Glass Substrates for Packaging

YAN Weiwei, ZHU Zeli, LI Jingming   

  1. ShenzhenLaibao Hi-Tech Co., Ltd., Shenzhen 518000, China
  • Received:2023-07-28 Online:2024-01-15 Published:2024-01-15

摘要: 通过理论分析、仿真模拟、实验验证相结合的方法对封装用玻璃基板的热应力翘曲进行研究。结果表明,相较于传统的有机化合物基板,玻璃基板降低热应力翘曲的效果十分显著。以双材料板模型为研究对象,通过对不同模型进行分析对比,总结了不同因素对热应力翘曲的影响。增加玻璃基板的厚度对降低翘曲的效果最为显著。提高玻璃基板的热膨胀系数(CTE),使其接近堆积膜的CTE,有助于降低翘曲。对堆积膜进行较多的分区可以显著改善翘曲。同时,重力也是不可忽略的影响因素,产品的放置方式决定了翘曲方向并影响翘曲值。

关键词: 热应力翘曲, 玻璃基板, 仿真实验, 双材料板

Abstract: Thermal stress warping of glass substrates for packaging is investigated through a combination of theoretical analysis, simulation and experimental verification. The results show that the glass substrates have a significant effect in reducing thermal stress warping compared to the traditional organic compound substrates. Taking the bi-material plate model as the research object, the effects of different factors on thermal stress warping are summarized by analyzing and comparing different models. Increasing the thickness of the glass substrates has the most significant effect on reducing warping. Improving the coefficient of thermal expansion (CTE) of the glass substrates to be close to the CTE of the stacked films can help to reduce warping. Dividing the stacked film into more zones can significantly improve warping. Meanwhile, gravity is also an important factor that cannot be ignored. The placement of the product determines the direction of warping and affects the warping value.

Key words: thermal stress warping, glass substrates, simulation experiment, bi-material plate

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