中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航

电子与封装 ›› 2024, Vol. 24 ›› Issue (2): 020104 . doi: 10.16257/j.cnki.1681-1070.2024.0032

所属专题: 高密度有机封装基板

• “高密度有机封装基板”专题 • 上一篇    下一篇

有机基板用增层膜性能与一致性的探讨

李会录1,2,张国杰3,魏韦华1,李轶楠3,刘卫清1,杜博垚1   

  1. 1.? 西安天和嘉膜工业材料有限责任公司,西安 ?710119;2. 西安科技大学材料科学与工程学院,西安? 710054;3. 无锡中微高科电子有限公司,江苏 无锡? 214061
  • 收稿日期:2023-08-31 出版日期:2024-02-29 发布日期:2024-02-29
  • 作者简介:李会录(1966—),男,陕西富平人,博士,副教授,研究方向为功能高分子材料和光电子封装材料。

Study on Properties and Consistency of Build-up Film for Organic

LI Huilu1,2, ZHANG Guojie3,WEI Weihua1, LI Yi'nan3, LIU Weiqing1, DU Boyao1   

  1. 1. Xi'an Tianhe Jia Film Industrial Materials Co., Ltd., Xi'an, 710119, China; 2. College of Materials Science and Engineering, Xi'an University of Science and Technology, Xi'an, 710054, China; 3. Wuxi Zhongwei High-Tech Electronics Co., Ltd., Wuxi, 214061, China
  • Received:2023-08-31 Online:2024-02-29 Published:2024-02-29

摘要: 增层膜是集成电路封装用有机基板的关键材料,起到绝缘、导热和的电气连接的作用。增层膜性能是由树脂体系、固化体系、填料以及膜的半固化处理等因素决定的。从国内外增层膜研究现状以及集成电路封装用有机基板的发展趋势出发,研究影响增层膜性能一致性的因素,并对增层膜低收缩率、高剥离力、低介电性和热稳定性的发展方向进行了探讨。控制电子级环氧树脂环氧当量、分子量和分子量大小分布等性能可实现膜加工性和性能一致性。环氧基的增层膜是高密度封装有机基板的主流产品,随着介电常数和损耗越来越小的要求,环氧树脂非极性和对称官能团的改性变得越来越重要。

关键词: 有机基板, 增层膜, 成膜性, 填料, 半固化

Abstract: Build-up film is a key material for organic substrate used in integrated circuit package, which plays the role of insulation, thermal conductivity and electronic connection. The performance of the build-up film is determined by the resin system, curing system, filler, semi-curing treatment of the film and other factors. From the current research status of build-up film at home and abroad, as well as the development trend of organic substrate used in integrated circuit package, the factors affecting the consistency of the film performance are studied, and the development direction of low shrinkage, high peel strength, low dielectricity, and thermal stability of build-up film is discussed. Controlling the properties such as epoxy equivalent, molecular weight, and molecular weight distribution of electronic grade epoxy resin can achieve film processability and performance consistency. Epoxy based build-up films are the mainstream products of high-density package organic substrates. With the requirement of low dielectric constant and loss, the modification of nonpolar and symmetric functional groups of epoxy resin has become increasingly urgent.

Key words: organic substrate, build-up film, film-forming, filler, semi-curing

中图分类号: