关键词: 毫米波微带天线, 高密度基板, 无引线集成

Abstract: Compared with the traditional integration technology, the multi-layer structure of the organic substrate can not only integrate multiple antennas, such as phased array antennas and stacked microstrip antennas, but also shows great advantages in wiring density, chip embedding and package integration. The design and fabrication process of Ka-band stacked microstrip antenna based on high density organic substrate process are introduced, and its reflection characteristics are verified by testing. The use of organic substrate to integrate antennas is conducive to the miniaturization of wireless communication systems, and it has great potential for application in the fields of communication and radar detection.

Key words: millimeter wave microstrip antenna, high density substrate, wire-free integration