表面贴装大功率器件热匹配问题可靠性仿真*

doi:10.16257/j.cnki.1681-1070.2025.0083

电子与封装 ›› 2025, Vol. 25 ›› Issue (3): 030109 . doi: 10.16257/j.cnki.1681-1070.2025.0083

所属专题：第三代半导体功率电子封装技术

• “第三代半导体功率电子封装技术”专题 • 上一篇下一篇

表面贴装大功率器件热匹配问题可靠性仿真^*

胡运涛¹,苏昱太¹,刘灿宇²,刘长清²

1.西北工业大学力学与土木建筑学院，西安 ?710072；2. 华中科技大学机械科学与工程学院，武汉 ?430074

收稿日期:2024-11-11 出版日期:2025-03-28 发布日期:2025-02-21
作者简介:胡运涛（2000—），男，湖北孝感人，硕士研究生，主要研究方向为电子封装可靠性、材料本构。

Reliability Simulation of Thermal Matching Issues in Surface-Mounted High-Power Devices

HU Yuntao¹, SU Yutai¹, LIU Canyu²,LIU Changqing²

1. Schoolof Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an 710072, China; 2. School of Mechanical Science and Technology,Huazhong University of Science and Technology, Wuhan 430074, China

Received:2024-11-11 Online:2025-03-28 Published:2025-02-21

摘要/Abstract

摘要： 针对表面贴装大功率器件中不同材料间热膨胀系数差异所引起的热力学不匹配问题，在不同升温速率下对关键互连结构的寿命与可靠性进行分析。探讨了材料热膨胀不匹配对器件性能和长期可靠性所带来的潜在影响。利用Anand本构模型详细描述了SAC305焊料的力学特性，重点分析了其应力应变与温度特性。基于Coffin-Manson模型进行了寿命评估，系统分析了焊料的疲劳失效与塑性应变的关系。仿真结果表明，温度变化速率越大，热力不匹配越明显，导致元器件内部产生较大的热应力和热疲劳效应，使得元器件寿命及可靠性降低。

关键词: 表面贴装器件, Anand本构模型, Coffin-Manson模型, 可靠性分析

Abstract: To address the thermomechanical mismatch problem caused by differences in the coefficient of thermal expansion between different materials in surface-mounted high-power devices, the lifetime and reliability of key interconnection structures are analyzed under different heating rates. The potential impact of material thermal expansion mismatches on device performance and long-term reliability is explored. The mechanical properties of SAC305 solder are investigated in detail through the Anand constitutive model, focusing on the stress-strain and temperature characteristics. The lifetime assessment is conducted based on the Coffin-Manson model, and the relationship between solder fatigue failure and plastic strain is systematically analyzed. The simulation results indicate that the larger the temperature change rate, the more obvious thermal-mechanical mismatch becomes, resulting in significant thermal stress and fatigue effects within the components, which leads to a decrease in their lifetime and reliability.

Key words: surface-mounted device, Anand constitutive model, Coffin-Manson model, reliability analysis

中图分类号:

TN406

胡运涛,苏昱太,刘灿宇,刘长清. 表面贴装大功率器件热匹配问题可靠性仿真^*[J]. 电子与封装, 2025, 25(3): 030109 .

HU Yuntao, SU Yutai, LIU Canyu,LIU Changqing. Reliability Simulation of Thermal Matching Issues in Surface-Mounted High-Power Devices[J]. Electronics & Packaging, 2025, 25(3): 030109 .

参考文献

[1] 冯家驹, 范亚明, 房丹, 等. 氮化镓功率电子器件封装技术研究进展[J]. 人工晶体学报, 2022, 51(4): 730-749.
[2] 顾鹏飞, 郭怀新, 沈国策, 等. GaN功率器件片内微流热管理技术研究进展[J]. 电子元件与材料, 2020, 39(6): 1-7.
[3] SCHROEDER K, TUGMAN S. 表面贴装技术与大功率电阻的发展走向[J]. 电子产品世界, 2003, 10(14): 27-28.
[4] 张宝良. SMD元件焊接缺陷对可靠性的影响研究 [J]. 电子通信与计算机科学, 2024, 6(7): 55-57.
[5] 杨洁竺. 惠州永鑫源推出体积更小，功率更大的SMD BOBBIN [J]. 磁性元件与电源, 2014, (11): 64.
[6] 田久良, 洪军, 朱永生, 等. 机床主轴-轴承系统热-力耦合模型及其动态性能研究[J]. 西安交通大学学报, 2012, 46(7): 63-68.
[7] LEE W W, NGUYEN L T, SELVADURAY G S. Solder joint fatigue models: review and applicability to chip scale packages[J]. Microelectronics Reliability, 2000, 40(2): 231-244.
[8] KIM I, LEE S B. Reliability and failure analysis of lead-free solder joints for PBGA package under a cyclic bending load[J]. IEEE Transactions on Components and Packaging Technologies, 31(2): 478-484.
[9] MCCLUSKEY F P, DASH M, WANG Z, et al. Reliability of high temperature solder alternatives[J]. Microelectronics Reliability, 2006, 46(9/10/11): 1910-1914.
[10] DICARLO J A. Creep of chemically vapour deposited SiC fibres[J]. Journal of Materials Science, 1986, 21(1): 217-224.
[11] ZHU S J, MIZUNO M, KAGAWA Y, et al. Creep and fatigue behavior of SiC fiber reinforced SiC composite at high temperatures[J]. Materials Science and Engineering: A, 1997, 225(1/2): 69-77.
[12] NAVARRO L A, PERPINA X, GODIGNON P, et al. Thermomechanical assessment of die-attach materials for wide bandgap semiconductor devices and harsh environment applications[J]. IEEE Transactions on Power Electronics, 29(5): 2261-2271.
[13] BAI J G, LU G Q. Thermomechanical reliability of low-temperature sintered silver die attached SiC power device assembly[J]. IEEE Transactions on Device and Materials Reliability, 2006, 6(3): 436-441.
[14] BAI J G, YIN J, ZHANG Z Y, et al. High-temperature operation of SiC power devices by low-temperature sintered silver die-attachment[J]. IEEE Transactions on Advanced Packaging, 30(3): 506-510.
[15] LI J F, YAQUB I, CORFIELD M, et al. Comparison of thermo-mechanical reliability of high-temperature bonding materials for attachment of SiC devices[C]//8th International Conference on Integrated Power Electronics Systems Proceedings: CIPS 2014, Nuremberg, Germany, 2014.
[16] LONG X, CHEN Z B, WANG W J, et al. Parameterized Anand constitutive model under a wide range of temperature and strain rate: experimental and theoretical studies[J]. Journal of Materials Science, 2020, 55(24): 10811-10823.
[17] 赵帅帅, 陈永祥, 贾业宁, 等. 基于修正Coffin-Manson模型的加速寿命试验设计与评估[J]. 强度与环境, 2013, 40(4): 52-58.
[18] LONG X, CHONG K N, CHANG C, et al. Meso-scale crystal plasticity modeling of sintered silver nanoparticles in typical interconnected structures[C]//2023 24th International Conference on Electronic Packaging Technology (ICEPT), Shihezi, China, 2023.

中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

表面贴装大功率器件热匹配问题可靠性仿真^*

Reliability Simulation of Thermal Matching Issues in Surface-Mounted High-Power Devices

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