关键词: 钎料, 单轴拉伸, 黏塑性, Anand本构模型

Abstract: The uniaxial tensile mechanical behavior of 0.1Sb-doped Sn57Bi solder alloy is analyzed under varying conditions, including different temperatures (25, 60, 80,100, 120 ℃) and strain rates (0.0001, 0.001, 0.005, 0.01, 0.05, 0.1 s^-1). Experimental results indicate that the Sn57Bi0.1Sb solder exhibits significant temperature and strain rate correlation. As the temperature rises, the tensile strength decreases, and as the strain rate increases, the tensile strength increases. Under high temperature conditions, the initial strengthening phase of the material is prolonged, and the overall strength growth rate slows down. Based on the experimental data, the parameters for the Anand constitutive model are determined using a nonlinear data fitting method, and nine important parameters describing the viscoplastic behavior of materials are extracted. The Anand model effectively captures the stress-strain response of materials under diverse conditions through internal variables, including multiple influencing factors such as temperature, strain rate, and hardening/softening effects. The model's accuracy is validated through experimental data, and the obtained parameters can provide a reliable reference for subsequent finite element simulations and material design in engineering applications.

Key words: solder, uniaxial tension, viscoplasticity, Anand constitutive model