关键词: 银电化学迁移, 半导体功率器件, 芯片金属, 铅锡可焊接金属

Abstract: Silver, as a weldable metal, can significantly improve process adaptability by forming low-temperature alloys with Pb, Sn and other materials, and is widely used in the field of semiconductor power devices. The electrochemical migration of silver in the interconnection between chip metal and packaging often leads to short-circuiting of the device, resulting in failure. In order to reduce such failures, the mechanism of silver electrochemical migration is studied, and improvement measures are proposed from the aspects of chip and packaging. Adding a protective layer of the chip and reducing the delamination of package epoxy resin and chip can reduce the erosion of water vapor on the chip surface, which is the key to alleviating silver electrochemical migration.

Key words: silver electrochemical migration, semiconductor power device, wafer metal, Pb-Sn solderable metal