基于AFM-IR的电子铜箔表面痕量有机物的原位检测与去除*

doi:10.16257/j.cnki.1681-1070.2025.0032

电子与封装 ›› 2025, Vol. 25 ›› Issue (4): 040202 . doi: 10.16257/j.cnki.1681-1070.2025.0032

基于AFM-IR的电子铜箔表面痕量有机物的原位检测与去除^*

李林玲¹，王勇¹，印大维²，章晨¹，滕超¹，陈葳³，江伟³，李大双²，郑小伟²，周东山³，薛奇^1,3

李林玲，王勇，印大维，章晨，滕超，陈葳，江伟，李大双，郑小伟，周东山，薛奇

收稿日期:2024-09-18 出版日期:2025-04-29 发布日期:2025-04-29
作者简介:李林玲（1986—），男，江苏如皋人，博士，特聘教授，主要研究方向为高分子复合材料界面微结构和动力学行为表征与调控。

In-Suit Detection and Removal of Trace Organics on the Surface of Electronic Copper Foils by AFM-IR

LI Linling¹, WANG Yong¹, YIN Dawei², ZHANG Chen¹, TENG Chao¹, CHEN Wei³, JIANG Wei³, LI Dashuang², ZHENG Xiaowei², ZHOU Dongshan³, XUE Gi[s2] ^1,3

1. Instituteof Critical Materials for Integrated Circuits, Shenzhen PolytechnicUniversity, Shenzhen 518055, China; 2. AnhuiTongguan Copper Foil Group Co., Ltd., Chizhou 247100; 3. ChinaSchool of Chemistry and Chemical Engineering, Nanjing University, Nanjing 210023, China

Received:2024-09-18 Online:2025-04-29 Published:2025-04-29

摘要/Abstract

摘要： 高性能电子铜箔是新一代通信技术所用高频高速PCB板的核心原材料之一，铜电沉积后表面吸附有机添加剂的控制对电子铜箔的性能有重要影响。基于原子力显微-红外光谱（AFM-IR）技术极高的检测灵敏度和空间分辨率，原位检测到国产铜箔表面残留的痕量有机杂质为整平剂明胶，并通过铜箔表面化学成像分析，发现这些残留的整平剂以零星状吸附于铜瘤顶部和侧面的钝化层之上。在AFM-IR方法的监测下，对二氯甲烷溶剂洗涤去除铜箔表面残留痕量有机杂质的效率进行了定量分析。相关工作将会有助于铜箔表面处理工艺的优化，以实现国产电子铜箔的高性能化。

关键词: 原子力显微-红外光谱, 铜箔, 痕量有机物检测, 表面处理, PCB

Abstract: High-performance electronic copper foil is one of the core raw materials for high-frequency and high-speed PCB used in new-generation communication technologies. The control of adsorbed organic additives on the surface after copper electrodeposition has an important influence on the performance of electronic copper foil. Based on the extremely high detection sensitivity and spatial resolution of the atomic force microscopy-based infrared spectroscopy (AFM-IR) technique, the trace organic additives remaining on the surface of domestic copper foil are detected in situ as the leveling agent gelatin, and analyzed by the copper foil surface chemical imaging, which reveals that these residual leveling agents are adsorbed in a sporadic manner on top and side of the passivation layer of the copper tumors. The efficiency of dichloromethane solvent washing to remove residual trace organic impurities remaining on the surface of copper foils is quantitatively analyzed under the monitoring of AFM-IR method. The related work will contribute to the optimization of the surface treatment process of copper foil and the realization of high performance of domestic electronic copper foil.

Key words: atomic force microscopy-based infrared spectroscopy, copper foil, detection of trace organic, surface treatment, PCB

中图分类号:

O656.21

李林玲，王勇，印大维，章晨，滕超，陈葳，江伟，李大双，郑小伟，周东山，薛奇. 基于AFM-IR的电子铜箔表面痕量有机物的原位检测与去除^*[J]. 电子与封装, 2025, 25(4): 040202 .

LI Linling, WANG Yong, YIN Dawei, ZHANG Chen, TENG Chao, CHEN Wei, JIANG Wei, LI Dashuang, ZHENG Xiaowei, ZHOU Dongshan, XUE Gi[s2] . In-Suit Detection and Removal of Trace Organics on the Surface of Electronic Copper Foils by AFM-IR[J]. Electronics & Packaging, 2025, 25(4): 040202 .

参考文献

[1] 祝大同. In高频高速覆铜板发展的新趋势[C]// 2021年中国覆铜板行业高层论坛, 西宁, 青海, 中国, 2021: 84-109.
[2] MORIMOTO Y, MOTEGI T, KASAI W, et al. Transmission line loss properties of dielectric loss tangent and conductive surface roughness in 5G millimeter wave band[C]//2020 IEEE Asia-Pacific Microwave Conference (APMC), Hong Kong, China, 2020: 776-778.
[3] SUZUKI O. Nanoscale profile copper for high speed transmission printed wiring boards[C]// Pan Pacific Microelectronics Symposium (Pan Pacific), Kauuai, HI, USA, 2017.
[4] LI Z C, PAN J L, HU H W, et al. Recent advances in new materials for 6G communications[J]. Advanced Electronic Materials, 2022, 8(3): 2100978.
[5] 孙玥; 刘玲玲; 李鑫泉; 等. 添加剂对电解铜箔作用机理及作用效果的研究进展[J]. 化工进展, 2021, 40 (11): 5861-5874.
[6] 师慧娟, 陆冰沪, 樊小伟, 等. 电解铜箔表面处理技术及添加剂研究进展[J]. 中国有色金属学报, 2021, 31(5): 1270-1284.
[7] CHANG T R, JIN Y, WEN L, et al. Synergistic effects of gelatin and convection on copper foil electrodeposition[J]. Electrochimica Acta, 2016, 211: 245-254.
[8] ZENG T W, YEN S C. Effects of additives in an electrodeposition bath on the surface morphologic evolution of electrodeposited copper[J]. International Journal of Electrochemical Science, 2021, 16(2): 210245.
[9] WANG S P, WEI K X, WEI W, et al. Enhancing surface roughness and tensile strength of electrodeposited copper foils by composite additives[J]. Physica Status Solidi (a), 2022, 219(5): 2100735.
[10] SUN Y, PAN J F, LIU L L, et al. Improvement of performance stability of electrolytic copper foils by bi-component additives[J]. Journal of Applied Electrochemistry, 2022, 52(8): 1219-1230.
[11] DAZZI A, PRATER C B. AFM-IR: technology and applications in nanoscale infrared spectroscopy and chemical imaging[J]. Chemical Reviews, 2017, 117(7): 5146-5173.
[12] KUROUSKI D, DAZZI A, ZENOBI R, et al. Infrared and Raman chemical imaging and spectroscopy at the nanoscale[J]. Chemical Society Reviews, 2020, 49(11): 3315-3347.
[13] MATHURIN J, DENISET-BESSEAU A, BAZIN D, et al. Photothermal AFM-IR spectroscopy and imaging: status, challenges, and trends[J]. Journal of Applied Physics, 2022, 131(1): 010901.
[14] LU F, JIN M Z, BELKIN M A. Tip-enhanced infrared nanospectroscopy via molecular expansion force detection[J]. Nature Photonics, 2014, 8(4): 307-312.
[15] NGUYEN-TRI P, GHASSEMI P, CARRIERE P, et al. Recent applications of advanced atomic force microscopy in polymer science: a review[J]. Polymers, 2020, 12(5): 1142.

中国电子学会电子制造与封装技术分会会刊

中国半导体行业协会封测分会会刊

无锡市集成电路学会会刊

基于AFM-IR的电子铜箔表面痕量有机物的原位检测与去除^*

In-Suit Detection and Removal of Trace Organics on the Surface of Electronic Copper Foils by AFM-IR

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