关键词: T/R开关, 封装设计, 有限元分析

Abstract: Packaging is the main part in T/R switch.The main mechanism of switch package failure concludes shell failure and LTCC bases failure.For in void of the packaging failure,we do modal analysis and transient analysis using ANSYS 14.0,get acceleration response value and inherent frequency of the shell,then have some experiments such as random vibration test and half-sinusoidal impact test to test the results of analysis and reliability.The results of experiments show that the shell package can ensure that the component can with stand impact and vibration of acceleration above 40g.

Key words: T/R switch, package design, FEA