关键词: 芯片翘曲, 有限元仿真, 双曲率

Abstract: The asymmetric structure and mismatch of coefficient of thermal expansion may lead to warpage of micro-electronic package due to the temperature change .The micro-electronic warpage may affect product reliability and quality. A fast predictive model for the package warpage is important for the design of package structure and material selection. The paper establishes a dual-curvature (DC) model to predicate the package warpage using the laminated theory. The samples are measured by Shadow moire and further verified by the finite element model. The experiment and simulation prove the accuracy of this model. In addition, this model can be further developed to predicate the warpage of other multi-layers structure, having a great potential for the package optimization.

Key words: chip warpage, finite element analysis, dual curvature