关键词: 金丝键合, 统计过程控制SPC, 工序能力指数, 分析

Abstract: The quality of gold wire-bonding is an important influential factor of reliability and microwave characteristic of microwave multi-chip module (Microwave MCM). Identifying and controlling the volatility effectively during the bonding process is significant to ensure stability and yields. Statistic Process Control (SPC) is the core technology to quantitatively measure the status of controllment. In the paper, normal distribution fitting and normality test are performed based on a product′s bonding strength data. The x-s control chart and x-R control chart are adopted to analyze the stability of bonding strength data. The influential factors and solutions are discussed in different volatility conditions. The process capability index of gold wire-bonding are calculated and evaluated. Furthermore, an effective method of improving the Cpk value is discussed in details.

Key words: gold wire-bonding, statistical process control（SPC）, process capability index, analysis