关键词: 集成电路, DIP, 陶瓷封装, 平移, 筛选

Abstract: At present, the integrated circuit packaging forms that can support screening by translational automatic screening equipment on the market are mainly SOP, BGA, QFN, QFP, CSP, etc., but there is no DIP package (DIP-Dual In-Line Package-dual-in-line Package).This paper describes the difficulties and solutions of screening DIP ceramic seal on the translation equipment. The difficulties are as follows: first, the long pin of the DIP package integrated circuit makes it difficult to carry the integrated circuit in the automatic screening process; second, before and after the IC test, it is difficult to plug and unplug in the test seat. In view of the above two difficult problems, it is necessary to carry out customized transformation of the translation equipment, develop and design relevant institutions to cooperate with the application of the translation equipment. After many trials and verifications, the problem of the inability to test and screen DIP packaged integrated circuits on the translation equipment was finally solved, the production compatibility of the translation equipment was enhanced, and the market gap was filled.

Key words: integrated circuits, Dual In-Line Package, ceramicpackage, horizontally, filtrate