关键词: 金脆, 搪锡去金, 丝网印刷, 真空回流焊接

Abstract: Sn-Pb solder was widely used in micro-assembly technology of aerospace electronic products due to its excellent soldering property and high reliability. Sn-Pb alloy reacts with gold of gold-plated pads producing brittle intermetallic compound during vacuum reflow soldering of microwave module. Brittle intermetallic compound will cause gold embrittlement and lead to invalid of electronic products. The de-golding process of gold-plated pads is necessary in order to improve the reliability of solder joints and products. In this paper, the process method of the tin-coating and de-golding of the microstrip plate is introduced, and the long-term reliability of the welding point is improved by the experiment.

Key words: goldembrittlement, tin-coating and de-golding, silk screen printing, vacuum reflowsoldering