关键词: 高密度封装, 互连结构, 差分串扰

Abstract: In view of large analysis errors in the traditional model, modeling and analysis of differential crosstalk of the interconnect structure in high density packaging is put forward. Based on the coupling analysis of differential transmission line of interconnection structure, a four line differential structure crosstalk model is established. This model is used to perform equivalent analysis on the resistance, capacitance and inductance of the differential crosstalk interconnect structure and to solve the differential crosstalk problem of interconnect structure in high density packaging. The experiments show that the average error model is 0.042, which meets the accuracy requirements in the inhibition of the differential crosstalk problem of interconnect structure in high density packaging.

Key words: highdensitypackaging, interconnectionstructure, thedifferentialcrosstalk