热超声键合第二焊点研究进展

doi:10.16257/j.cnki.1681-1070.2021.0713

摘要/Abstract

摘要： 热超声键合是目前最重要的引线键合技术，在电子封装领域中有着广泛的应用。面对封装密度不断提高、焊点节距不断下降和成本持续降低等挑战，工程技术人员需要全面了解热超声键合技术的研究进展。热超声键合包括两个焊点，其在外形、键合过程和冶金特性等方面均不相同。对于热超声键合中的第一焊点已有较为深入的研究。但是，关于热超声键合第二焊点仍缺乏系统的论述，不能很好地帮助工程技术人员应对挑战。通过总结键合机理、键合质量和可靠性测试等方面的研究成果，介绍热超声键合第二焊点研究的发展现状，并对研究方向提供建议。

关键词: 引线键合, 热超声键合, 第二焊点, 键合机理, 键合质量, 键合可靠性

Abstract: Thermosonic bonding, which has been extensively applied in electronic packaging, is the most important wire bonding technology at present. Confronted with the challenges, including increased packaging density, decreasing bond pitch and keeping cost as low as possible, it is necessary for engineers to fully understand the research progress in thermosonic bonding technology. Thermosonic bonding includes two bonds, which are different in shape, bonding process and metallurgy. The first bond in thermosonic bonding has been deeply studied. However, there is a lack of systematic discussion on the second bond of thermosonic bonding, which could not help engineers deal with the challenges.The advances in the second bond of thermosonic bonding is presented by summarizing the investigation on bonding mechanism, bonding quality and reliability test, and the advices on further research are provided.

Key words: wirebonding, thermosonicbonding, secondbond, bondingmechanism, bondingquality, bondingreliability

中图分类号:

TN305.94

徐庆升;陈悦霖. 热超声键合第二焊点研究进展[J]. 电子与封装, 2021, 21(7): 070204 .

XU Qingsheng, CHEN Yuelin. Progress inthe Second Bond of Thermosonic Bonding[J]. Electronics & Packaging, 2021, 21(7): 070204 .

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