关键词: 粘片胶, 分层, 可靠性

Abstract: Because of the plastic packaging process，the chip should always and molding compound adhesive binding，there is the reliability problems can not be overcome.Such as chip layer，adhesive layer and so on.Many studies have no longer discuss stratified，chip，here mainly analyzes the influence of adhesive layer on the reliability of products.Due to the high temperature adhesive curing time is not enough，not the vapor temperature adhesive in a completely discharged，the product is heated，the water vapor in high temperature adhesive in the rapid expansion，cause abdominal burst，product reliability can not be through.

Key words: adhesive, layered, reliability