关键词: 毫米波, 封装, 通道, 优化

Abstract: As the 5G era comes, the millimeter-wave package market is growing continuously. The product working frequency becomes higher, and it’s also more strict for designing and packaging .The high performance millimeter-wave package should have good RF performance in a wide frequency band .The existing packaging design strategies are based on the old design rules and 2D/2.5D modeling tools, and its accuracy can’t meet the requirements of millimeter-wave product development . In the development of millimeter wave products, it is necessary to carry out simulations and optimizations in 3D software HFSS at the design stage, as to realize the synchronization of simulation and design. This paper described a design and optimization method of FC-LGA (flip chip-land grid array) package. By carefully optimizing the channel model, it achieved good reflection and insertion loss characteristics in the 0-30 GHz frequency range, and optimized the crosstalk as far as possible in the process.

Key words: millimeter-wave, package, channel, optimization