关键词: 导电胶, 粘接工艺, 可伐载板, 可靠性

Abstract: Conductive adhesive is a promising interconnecting material, and bonding reliability of conductive adhesive has become one of the difficulties in its application. Based on the bonding failure analysis of a mixing module, this paper explores the influence of temperature test conditions and the size of substrate on the bonding reliability of the Kovar alloy substrate. Through simulation and experimental design, the stress distribution at the bonding interface of different size substrate under different temperature test conditions is studied, and the bonding technology of the Kovar alloy substrate is also optimized. The results show that the harsher the temperature test condition and the larger the size of substrate, the worse the bonding reliability of the Kovar alloy substrate. The bonding technology of the Kovar alloy substrate can be optimized by insulating epoxy adhesive or flexible conductive adhesive.

Key words: conductiveadhesive, bondingtechnology, Kovaralloysubstrate, reliability