中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (2): 020103 . doi: 10.16257/j.cnki.1681-1070.2021.0212

所属专题: GaN 电子器件与先进集成

• “GaN 电子器件与先进集成”专题 • 上一篇    下一篇

GaN单片功率集成电路研究进展*

赖静雪,陈万军,孙瑞泽,刘超,张波   

  1. 电子科技大学电子薄膜与集成器件国家重点实验室,成都 610054
  • 收稿日期:2020-12-22 出版日期:2021-02-24 发布日期:2021-01-14
  • 作者简介:赖静雪(1997—),女,四川成都人,硕士研究生,主要研究方向是氮化镓功率集成电路。

Development of GaN Monolithic Power Integrated Circuits

LAI Jingxue, CHEN Wanjun, SUN Ruize, LIU Chao, ZHANG Bo   

  1. State KeyLaboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science andTechnology of China, Chengdu 610054, China
  • Received:2020-12-22 Online:2021-02-24 Published:2021-01-14

摘要: GaN HEMT器件具有工作频率高、导通损耗小等优点,已经开始广泛应用在多种高频、高效功率转换器中,而拥有更高集成度的全GaN单片集成电路可进一步提高基于GaN HEMT器件功率变换器的性能。介绍了不同类型的全GaN集成工艺平台以及GaN功能子电路的研究进展,并对全GaN单片集成功率IC的研究现状进行了综述。

关键词: AlGaN/GaN HEMT, 全氮化镓, 变换器IC, 单片集成, 功率变换

Abstract: GaN HEMT devices, which have excellent features such as high breakdown voltage and low on-resistance, have been widely applied in high voltage, high frequency and high efficiency power converters. Higher integration of all-GaN monolithic IC can further advance the performance of power converters based on GaN HEMT. This article introduces several all-GaN integration platforms and basic GaN functional subcircuits, then the research status of all-GaN monolithic integrated power converter are reviewed.

Key words: AlGaN/GaNHEMT, all-GaN, converterIC, monolithicintegration, powerconversion

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