中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (5): 050401 . doi: 10.16257/j.cnki.1681-1070.2021.0509

• 微电子制造与可靠性 • 上一篇    下一篇

深亚微米SOI工艺ESD防护器件设计

米丹;周昕杰;周晓彬;何正辉;卢嘉昊   

  1. 中国电子科技集团公司第58研究所,江苏 无锡 214072
  • 收稿日期:2020-11-15 出版日期:2021-05-18 发布日期:2020-12-25
  • 作者简介:米丹(1976—),女,辽宁绥中人,工程硕士,工程师,现从事抗辐射集成电路设计及抗辐射加固技术研究工作;

ESD Protection Device Design Based on Deep SubmicronSOI Technology

MI Dan, ZHOU Xinjie, ZHOU Xiaobin, HE Zhenghui, LU Jiahao   

  1. China Electronics Technology GroupCorporation No.58 Research Institute,Wuxi 214072, China
  • Received:2020-11-15 Online:2021-05-18 Published:2020-12-25

摘要: 在集成电路设计领域,绝缘体上硅(SOI)工艺以其较小的寄生效应、更快的速度,得到广泛应用。但由于SOI工艺器件的结构特点及自加热效应(SHE)的影响,其静电放电(ESD)防护器件设计成为一大技术难点。当工艺进入深亚微米技术节点,基于部分耗尽型SOI(PD-SOI)工艺的ESD防护器件设计尤为困难。为了提高深亚微米SOI工艺电路的可靠性,开展了分析研究。结合SOI工艺器件的结构特点,针对性地进行了ESD防护器件选择,合理设计了器件尺寸参数,并优化设计了器件版图。使用该设计的一款数字电路,通过了4.5 kV人体模型(HBM)的ESD测试。该设计有效解决了深亚微米SOI工艺ESD防护器件鲁棒性弱的问题。

关键词: 深亚微米, SOI工艺, 自加热效应, ESD防护器件, 栅控二极管

Abstract: In the field of the integrated circuits design, the silicon on insulator (SOI) technology is used widely for the great advantage of less parasitic effects and faster speed. But the electro static discharge (ESD) protection device design becomes a big technical difficulty for the device’s structure feature and self-heating effects (SHE) of the SOI technology. When reaching the deep submicron technology node, the ESD protection device design becomes more difficult based on partially depleted SOI (PD-SOI) technology. A research was developed for improving the reliability of the deep submicron SOI technology. Associating with the device’s structure feature of the SOI technology, an ESD protection device was targeted, the device’s size and parameters were finalized, and the layout was designed optimally. A digital circuit has passed the human body model (HBM) ESD test above 4.5kV by using this design. The problem is solved efficiently of the weak robustness about the ESD protection device based on deep submicron SOI technology.

Key words: deepsubmicron, SOItechnology, self-heatingeffects, ESDprotectiondevice, lubistor

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